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    PCB Design & Layout

    From schematic to fabrication-ready Gerbers

    I design production-quality PCBs — from single-layer sensor boards to 8-layer high-speed mixed-signal systems. Every layout is optimized for signal integrity, manufacturability, and cost before it ever reaches the fab house.

    KiCAD & Altium DesignerUp to 8 layersHigh-speed signal integrityImpedance controlled tracesMixed signal designsDFM optimization

    Multi-Layer & Rigid-Flex Design

    Not all products fit on a 2-layer board. I design up to 8-layer rigid and rigid-flex PCBs (including 4+2 configurations) for space-constrained wearables, folded enclosures, and dense mixed-signal systems. Stackup design, impedance planning, and controlled-length routing are handled from day one — not patched in later.

    • 2-layer to 8-layer stackup design
    • Rigid-flex (4+2) for compact wearables and foldable assemblies
    • Impedance-controlled differential pairs and single-ended traces
    • Defined reference planes and return-current paths on every layer

    High-Speed & Mixed-Signal Integrity

    High-speed interfaces like USB, SDIO, SPI at >40 MHz, and camera buses require precise trace length matching, controlled impedance, and clean return paths. I handle signal integrity from the schematic stage — choosing proper termination, guard traces, and via stitching strategies so the board works the first time.

    • Differential pair routing (USB, Ethernet, LVDS)
    • Length-matched buses for cameras, SDRAM, and displays
    • Guard traces and via stitching for noise-sensitive analog sections
    • Proper decoupling strategy — placement, value, and via connection

    Design for Manufacturability (DFM)

    A beautiful layout that can't be reliably manufactured is useless. Every design I deliver is checked against real fab and assembly constraints — minimum annular rings, solder mask dams, component courtyard clearances, and panel utilization. I also verify component availability and suggest drop-in alternates where lead times are risky.

    • Fab-house DRC with real vendor rules (JLCPCB, PCBWay, etc.)
    • Component availability and alternate sourcing verification
    • BOM cost optimization without sacrificing performance
    • Proper thermal relief and copper balancing for reliable reflow

    Power Integrity & Thermal Management

    Power delivery is as important as signal routing. I design PDN (Power Distribution Networks) with proper plane splits, decoupling placement strategies, and copper pours sized for actual current loads. For high-power designs, thermal vias, heatsink pad exposure, and copper balancing are part of the layout — not bolt-on fixes.

    • PDN analysis and plane-split strategies
    • Thermal via arrays under power components and exposed pads
    • Copper balancing for uniform reflow and reduced board warp
    • Current-carrying capacity verified for all traces and vias

    Tools & Technologies

    KiCAD 8
    Altium Designer
    JLCPCB / PCBWay DRC rules
    Saturn PCB Toolkit
    IPC-2221 / IPC-7351 standards

    Frequently Asked Questions

    How many layers do I need for my project?

    It depends on the signal count, speed requirements, and form factor. Simple microcontroller boards work on 2 layers. Mixed-signal designs with USB, cameras, or RF typically need 4 layers. Dense designs with DDR, Ethernet, or rigid-flex constraints may need 6–8 layers. I'll recommend the optimal layer count during the initial review.

    Do you deliver Gerber files ready for fabrication?

    Yes. Every project includes fabrication-ready Gerbers, drill files, BOM, and centroid/pick-and-place files. I also provide the source KiCAD or Altium project so you own the design completely.

    Can you review an existing PCB layout?

    Absolutely. I offer PCB design reviews covering signal integrity, power integrity, DFM issues, and cost optimization — ideal before committing to a fabrication run.

    Need pcb design & layout for your project?

    Let's discuss your requirements and find the best approach for your hardware project.